Copper (II) Sulfate, Poly Methyl Structural Properties of Thick Films prepared from PMMA & Copper (II) Sulfate in different proportion

Section: Research Article
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Abstract

   In this research, some materials were used, including poly methyl methacrylate (PMMA) as a base material with chloroform as a pure solvent (99.8%) in addition to Copper (II) Sulfate (CuSO4) as an activator for the base material in percentages (25%, 50%,75%), the samples were subjected to several tests including X-ray diffraction (XRD). On the other hand, the results from the highest level of crystallization through the distinctive peaks at the activation percentage (25%) through the scanning electron microscopy (SEM) images, the nodal structures liberating gases appear with dimensions (0.24 μm - 0.27 μm) mostly it is a result of the overlapping the surface interactions between the activation material and the base material at the activation percentage (25%(,through the atomic force microscopy (AFM) images, the lowest surface roughness of the thick film at the activation percentage (75%) is around (46.4 nm), that is it gave the highest correlation between the activation material and the base material, and this reflects the stability of the activation material with the base material.

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Author Biographies

Muther M.kasim AL-Shammam (College of Environmental Scinces)

Environment Scince Department

Ahmed Noori Mahmood (College of Environmental Scinces)

Environment Scince Departement

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